CTQA Y-Segment Diamond Blade for Porcelain Tile

The CTQA Y-segment diamond blade is designed for fast, controlled cutting of porcelain tile, ceramic tile and quartz. The Y-pattern rim supports debris clearance and cutting speed, while the 1.3 mm thickness helps reduce chipping and material loss during installation work.

Applications

Porcelain and ceramic tile cutting
Quartz trimming
Tile installation and renovation
Dry or wet cutting with angle grinders

Technical Specifications

Model	CTQA
Diameter	100, 115 and 125 mm
Thickness	1.3 mm
Arbor	20 mm or 22.23 mm
Rim	Y-segment diamond rim
Materials	Porcelain, ceramic tile and quartz
Use	Dry or wet

Y-Segment Design

The Y-shaped segment pattern creates open paths around the rim to support debris removal and cooling. Use a steady feed rate and adequate support beneath the tile for the best edge quality.

Product Advantages

Y-segment rim for efficient tile cutting
Thin kerf for controlled cuts
Three compact diameters for angle grinders
Dry and wet cutting capability

Inquiry Information

Please provide the tile type and thickness, blade diameter, arbor, machine model and required quantity.

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